Development and Application of Embedded Ball Grid Array Packaging in Advanced Packaging Field

Dual Use Technologies & Products ›› 2025, Vol. 0 ›› Issue (7) : 56-60.

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Dual Use Technologies & Products ›› 2025, Vol. 0 ›› Issue (7) : 56-60.
Technical Research

Development and Application of Embedded Ball Grid Array Packaging in Advanced Packaging Field

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2025, 0(7): 56-60

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